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مشخصات فردي

نام و نام خانوادگي:عبدالرضا گرانمايه

مرتبه علمي :مربي

گروه آموزشي :مهندسي مکانيک

سمت اجرايي:عضو هييت علمي و نماينده پژوهشي گروه مهندسي مکانيک

پست الكترونيكيa_granmaye@azad.ac.ir:

سوابق تحصيلي:

كارشناسي ارشد مهندسي مواد

. دانشگاه آزاد اسلامي واحد تهران جنوب

عنوان پايان نامه: "غير فعال نمودن سطوح فولادي به روش شيميايي"

كارشناسي مهندسي مواد

 .دانشگاه صنعتي شريف

عنوان پايان نامه: "گوگرد و فسفرزدايي همزمان در چدن با استفاده از كربنات سديم "

 

سوابق آموزشي ـ تحقيقاتي:

سوابق آموزشي

عضو هيئت علمي رسمي گروه مهندسي مكانيك،دانشكده فني دانشگاه آزاد اسلامي واحد تهران جنوب (1374 تا كنون).

مدرس مدعو گروه مهندسي صنايع دانشگاه آزاد اسلامي واحد قزوين (1376-1374).

مدرس مدعو گروه مهندسي صنايع دانشگاه آزاد اسلامي واحد شمال (1376-1376).

مدرس مدعو گروه مهندسي صنايع دانشگاه اسلامي كار (1379-1379).

 

سوابق تدريس در مقطع كارشناسي:

علم مواد: 3 واحد نظري (100 بار در طول 12 سال)

عمليات حرارتي: 2 واحد نظري (10 بار)

شناخت فلزات صنعتي: 2 واحد نظري (30 بار)

كارگاه ريخته گري: 1واحد عملي (30 بار)

كارگاه عمومي (1): 1واحد عملي (60 بار)

كارگاه جوشكاري: 1واحد عملي (20 بار)

 

فعاليت هاي  پژوهشي:

1- بررسي رفتار خزشي آلياژهاي لحيم با استفاده از فرورونده هاي هرمي و استوانه اي شكل.

2- بررسي رفتار خزش فروروندگي منيزيم وآلياژهاي  Al-Mgتقويت شده با  نانوذرات Al2O3 .

3- پروژه هاي پاياني راهنمايي شده در مقطع كارشناسي: 100 دانشجو.       

4- همكاري در راهنمايي پروژه هاي پاياني در مقطع كارشناسي در دانشگاه تهران زير نظر دكتر محمودي : 17 دانشجو.

5- قراردادهاي تحقيقاتي با عنوان "بررسي رفتار خزش فروروندگي آلياژهاي بدون سرب حاوي عناصر كمياب خاكي مورد استفاده در صنايع الكترونيك (1385).

 

مقالات منتشر شده:

 

الف) مقاله دركنفرانس‌ها:

1. A.R. Geranmayeh and E. Roayaie, "Effect of surfactants on the rust converters of steels”, Proceedings of the 4th National Conference of Corrosion, Esfahan, Iran (1995) p.190.

 

2- A. Khalatbari, S.R. Mahmoodi, R. Mahmudi and A.R. Geranmayeh, "Investigation on the creep behavior of Sn-Bi alloys by hardness testing method”, Proceedings of the Tenth Congress of Iranian Metallurgical Society, Mashad-Iran, (2006).

 

3- R. Mahmudi, A.R. Geranmayeh, S.R. Mahmoodi and A. Khalatbari, "Indentation creep of lead-free Sn-Bi solder alloys as replacements of Sn-Pb used in microelectronic packaging”, Proceedings of the 16th International Manufacturing Technology, IEMT 2006, Kualalampur, Malaysia (2006) p.443.

 

ب) مقاله در ژورنال‌هاي ISI، علمي پژوهشي و علمي ترويجي:

1- A.R. Geranmayeh and R. Mahmudi, "Room temperature indentation creep of lead-free Sn-5% Sb solder alloy”, Journal of Electronic Materials, 34 (2005) 1002.

 

2- A.R. Geranmayeh and R. Mahmudi, "Power law indentation creep of Sn-5% Sb solder alloy”, Journal of Materials Science, 40 (2005) 3361.

 

3-  R. Mahmudi, A.R. Geranmayeh, and A. Rezaee-Bazzaz, "Impression creep of lead-free Sn-5% Sb solder alloy”, Materials Science and Engineering A, 448 (2007) 287.

 

4-  R. Mahmudi, A.R. Geranmayeh, and A. Rezaee-Bazzaz, "Impression creep behavior of cast Pb-Sb alloys”, Journal of Alloys and Compounds, 427 (2007) 124.

 

5-  R.Mahmudi, A.R. Geranmayeh, M.Bakherad, and M.Allami, "Indentation creep study of lead free Sn-5%Sb solder alloy” Materials Science and Engineering A, 457 (2007) 173.

 

6- R.Mahmudi, A.R. Geranmayeh, S.R.Mahmoodi, and A.Khalatbari, "Room-temperature indentation creep of lead free Sn-Bi solder alloys”, Journal of Materials Science (Materials In Electronics), 18 (2007) 1071.

 

7- R.Mahmudi, A.R. Geranmayeh, S.R.Mahmoodi, and A.Khalatbari, "Effect of cooling rate on the room temperature indentation creep of cast lead free Sn-Bi solder alloys”, Phys.Stat.Sol. (a)204, 7 (2007) 2302.

 

8- R.Mahmudi, A.R. Geranmayeh, M.Allami, and M.Bakherad, "Effect of homogenization on the indentation creep of cast lead-free Sn-5%Sb solder alloy” ,Journal of Electronic Materials, DOI: 10.1007/S11664-007-0275-5.

 

9-   R. Mahmudi, A.R. Geranmayeh, H. Noori, N. Jahangiri, H. Khanbareh, “ Effect of cooling rate on the room-temperature impression creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solders”, Materials Science and Engineering A, DOI: 10.1016/j.msea.2007.09.050.

 

10-   R. Mahmudi, A.R. Geranmayeh, H. Noori, M.Shahabi, “ Impression creep of hypoeutectic Sn-Zn lead free solder alloys”, Materials Science and Engineering A, DOI:10.1016/j.msea.2008.01.051.

 

11-  R. Mahmudi, A.R. Geranmayeh, H. Noori, N. Jahangiri, H. Khanbareh, “ A comparison of impression, indentation and impression-relaxation creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solders at room temperature”, Journal of Materials Science (Materials In Electronics), DOI:10.1007/s10854-008-9726-x.

 

12-   R. Mahmudi, A.R. Geranmayeh, H. Noori, G. Nayyeri, F. Pishbin, “ Creep of dilute tin-based lead-free solder alloys as replacements of Sn-Pb solders”, Materials Science and Technology, Accepted.

 

گزارشات علمي – تحقيقاتي:

طرح پژوهشي: تغيير مد ارتعاشي تار در حال ارتعاش در ساز سنتور

 

زمينه هاي اصلي علايق تحقيقاتي:

بررسي خواص مکانيکي آلياژها

سوابق اجرائي:

1- رييس کارگاه هاي گروه مهندسي مکانيک

2- نماينده پژوهشي گروه مهندسي مکانيک

Curriculum Vitae

 Personal ID

First Name: Abdolreza

Surname: Geranmayeh Oromyeh

Educational Degree: MSc

Grade:

 

 Address:

Department of ………….

E-mail :

A_granmayeh@azad.ac.ir

 

Educational History:

BSc: Materials Science Engineeering

MSc: Materials Science Engineeering

 

 Publications:

Journal Papers:

1- A.R. Geranmayeh and R. Mahmudi, "Room temperature indentation creep of lead-free Sn-5% Sb solder alloy”, Journal of Electronic Materials, 34 (2005) 1002.

 

2- A.R. Geranmayeh and R. Mahmudi, "Power law indentation creep of Sn-5% Sb solder alloy”, Journal of Materials Science, 40 (2005) 3361.

 

3-  R. Mahmudi, A.R. Geranmayeh, and A. Rezaee-Bazzaz, "Impression creep of lead-free Sn-5% Sb solder alloy”, Materials Science and Engineering A, 448 (2007) 287.

 

4-  R. Mahmudi, A.R. Geranmayeh, and A. Rezaee-Bazzaz, "Impression creep behavior of cast Pb-Sb alloys”, Journal of Alloys and Compounds, 427 (2007) 124.

 

5-  R.Mahmudi, A.R. Geranmayeh, M.Bakherad, and M.Allami, "Indentation creep study of lead free Sn-5%Sb solder alloy” Materials Science and Engineering A, 457 (2007) 173.

 

6- R.Mahmudi, A.R. Geranmayeh, S.R.Mahmoodi, and A.Khalatbari, "Room-temperature indentation creep of lead free Sn-Bi solder alloys”, Journal of Materials Science (Materials In Electronics), 18 (2007) 1071.

 

7- R.Mahmudi, A.R. Geranmayeh, S.R.Mahmoodi, and A.Khalatbari, "Effect of cooling rate on the room temperature indentation creep of cast lead free Sn-Bi solder alloys”, Phys.Stat.Sol. (a)204, 7 (2007) 2302.

 

8- R.Mahmudi, A.R. Geranmayeh, M.Allami, and M.Bakherad, "Effect of homogenization on the indentation creep of cast lead-free Sn-5%Sb solder alloy” ,Journal of Electronic Materials, DOI: 10.1007/S11664-007-0275-5.

 

9-   R. Mahmudi, A.R. Geranmayeh, H. Noori, N. Jahangiri, H. Khanbareh, “ Effect of cooling rate on the room-temperature impression creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solders”, Materials Science and Engineering A, DOI: 10.1016/j.msea.2007.09.050.

 

10-   R. Mahmudi, A.R. Geranmayeh, H. Noori, M.Shahabi, “ Impression creep of hypoeutectic Sn-Zn lead free solder alloys”, Materials Science and Engineering A, DOI:10.1016/j.msea.2008.01.051.

 

11-  R. Mahmudi, A.R. Geranmayeh, H. Noori, N. Jahangiri, H. Khanbareh, “ A comparison of impression, indentation and impression-relaxation creep of lead-free Sn-9Zn and Sn-8Zn-3Bi solders at room temperature”, Journal of Materials Science (Materials In Electronics), DOI:10.1007/s10854-008-9726-x.

 

12-   R. Mahmudi, A.R. Geranmayeh, H. Noori, G. Nayyeri, F. Pishbin, “ Creep of dilute tin-based lead-free solder alloys as replacements of Sn-Pb solders”, Materials Science and Technology, Accepted. 

Conference papers:

1. A.R. Geranmayeh and E. Roayaie, "Effect of surfactants on the rust converters of steels”, Proceedings of the 4th National Conference of Corrosion, Esfahan, Iran (1995) p.190.

 

2- A. Khalatbari, S.R. Mahmoodi, R. Mahmudi and A.R. Geranmayeh, "Investigation on the creep behavior of Sn-Bi alloys by hardness testing method”, Proceedings of the Tenth Congress of Iranian Metallurgical Society, Mashad-Iran, (2006).

 

3- R. Mahmudi, A.R. Geranmayeh, S.R. Mahmoodi and A. Khalatbari, "Indentation creep of lead-free Sn-Bi solder alloys as replacements of Sn-Pb used in microelectronic packaging”, Proceedings of the 16th International Manufacturing Technology, IEMT 2006, Kualalampur, Malaysia (2006) p.443.

 

Projects:

A novel method for fast tuning of Persian classical music instrument Santoor.

 

 

Fields of interest:

Mechanical behavior of alloys